Research Interests

• Hardware Reverse Engineering
• Physical Inpsection for Trust
• Hardware Assurance
• Side-Channel Analysis
• Implementation Security

Contact

• LinkedIn
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• ResearchGate
• ORCID

News

• Research Project: We are contributing to the funding project VE-FIDES of the German Ministry of Education and Research.
• Research Project: We are contributing to the funding project RESEC of the German Ministry of Education and Research.
• Research Project: We are contributing to the funding project AI4DI of ECSEL JU.
• Research Project: During my Master's thesis at Infineon Technologies AG, I contributed to the funding project SyPASS of the German Ministry of Education and Research.

Patents

• Verfahren und Vorrichtungen zur Sicherung einer Maske (Method and Apparatus for Securing a Mask)

  Bernhard Lippmann, Matthias Ludwig, Maximilian Putz.

  DE102022206815A1 (2024).

Publications

• Layout-Only Hardware Trojans: Attack Vectors and a Non-Golden Model Reverse Engineering-Based Counterstrategy

  Matthias Ludwig, Ann-Christin Bette, Bernhard Lippmann.

  Conference Proceedings from the 49th International Symposium for Testing and Failure Analysis (ISTFA) (2023), Phoenix, AZ, USA.

  Preprint


• PLaNe: Reverse Engineering of Planar Layouts to Gate-Level Netlists

  Maximilian Putz, Matthias Ludwig, Bernhard Lippmann, Helmut Graeb.

  IEEE Physical Assurance and Inspection of Electronics (PAINE) (2023), Huntsville, AL, USA.


• Towards a Comprehensive System for Physical Hardware Inspection for Trust

  Bernhard Lippmann, Matthias Ludwig, Detlef Houdeau, Nicola Kovac, Horst Gieser.

  IEEE Physical Assurance and Inspection of Electronics (PAINE) (2023), Huntsville, AL, USA.


• No-Reference Image Quality Assessment for Reverse Engineering of Integrated Circuits

  Ann-Christin Bette, Robin Falter, Matthias Ludwig, Bernhard Lippmann, Frank Siegelin, Peter Egger, Alois Knoll.

  IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (2023), Pulau Pinang, Malaysia.


• Quantifying Trust in Hardware through Physical Inspection

  Bernhard Lippmann, Matthias Ludwig, Horst Gieser.

  Workshop on Nano Security: From Nano-Electronics to Secure Systems at 2023 Design, Automation Test in Europe Conference Exhibition (DATE) (2023), Antwerp, Belgium.


• Counterfeit Detection by Semiconductor Process Technology Inspection

  Matthias Ludwig, Ann-Christin Bette, Bernhard Lippmann, Georg Sigl.

  28th IEEE European Test Symposium (ETS) (2023), Venice, Italy.


• Generating Trust in Hardware through Physical Inspection

  Bernhard Lippmann, Matthias Ludwig, Horst Gieser.

  Embedded Artificial Intelligence: Devices, Embedded Systems, and Industrial Applications (2022), IEEE Xplore.


• Boundary Enhanced Semantic Segmentation for High Resolution Electron Microscope Images

  Matthias Pollach, Felix Schiegg, Matthias Ludwig, Ann-Christin Bette, Alois Knoll.

  30th European Signal Processing Conference (EUSIPCO) (2022), Belgrade, Serbia.


• An End-to-End AI-based Automated Process for Semiconductor Device Parameter Extraction

  Dinu Purice, Matthias Ludwig, Claus Lenz.

  Industrial Artificial Intelligence Technologies and Applications (2022), River Publishers, Denmark.

  Link to full book


• Physical and Functional Reverse Engineering Challenges for Advanced Semiconductor Solutions

  Bernhard Lippmann, Ann-Christin Bette, Matthias Ludwig, Johannes Mutter, Johanna Baehr, Alexander Hepp, Horst Gieser, Nicola Kovac, Tobias Zweifel, Martin Rasche, Oliver Kellermann.

  Design, Automation & Test in Europe Conference & Exhibition (DATE) (2022), Antwerp, Belgium.


• Automated Defect Inspection in Reverse Engineering of Integrated Circuits

  Ann-Christin Bette, Patrick Brus, Gabor Balazs, Matthias Ludwig, Alois Knoll.

  IEEE/CVF Winter Conference on Applications of Computer Vision (WACV) (2022), Waikoloa, Hawaii, USA.


• CRESS: Framework for Vulnerability Assessment of Attack Scenarios in Hardware Reverse Engineering

  Matthias Ludwig, Alexander Hepp, Michaela Brunner, Johanna Baehr.

  IEEE Physical Assurance and Inspection of Electronics (PAINE) (2021), Washington, DC, USA.

  Preprint


• ViTaL: Verifying Trojan-Free Physical Layouts through Hardware Reverse Engineering

  Matthias Ludwig, Ann-Christin Bette, Bernhard Lippmann.

  IEEE Physical Assurance and Inspection of Electronics (PAINE) (2021), Washington, DC, USA.

  Preprint


• Towards Fully Automated Verification of Semiconductor Technologies (Invited)

  Matthias Ludwig, Dinu Purice, Bernhard Lippmann, Ann-Christin Bette, Claus Lenz.

  Artificial Intelligence for Digitising Industry - Applications (2021), River Publishers, Denmark.

  Link to full book


• Demo: A Fully Automated Process for Semiconductor Technology Analysis through SEM Cross-Sections

  Matthias Ludwig, Bernhard Lippmann, Ann-Christin Bette, Claus Lenz.

  Demo-Session on Medical and Industrial Imaging at IEEE/IAPR 25th International Conference on Pattern Recognition (2021), Milan, Italy.

  Demo-video


• Enabling Trust for Advanced Semiconductor Solutions Based on Physical Layout Verification

  Matthias Ludwig, Bernhard Lippmann, Niklas Unverricht.

  Intelligent System Solutions for Auto Mobility and Beyond (2021), Springer Nature, Switzerland.


• Verification of physical designs using an integrated reverse engineering flow for nanoscale technologies

  Bernhard Lippmann, Niklas Unverricht, Aayush Singla, Matthias Ludwig, Michael Werner, Peter Egger, Anja Duebotzky, Helmut Graeb, Horst Gieser, Martin Rasche, Oliver Kellermann.

  Integration the VLSI Journal (2020), Elsevier, Netherlands.

Miscellaneous

• Talk: 2024-03-20, Bochum, Hardware Reverse Engineering Workshop (HARRIS 2024), Electrical and Physical Characterization of Fingerprinting Primitives: A Study on SRAM and PCBs with Vincent Krämer (Link).
• Presentation: 2023-08-01, Infineon Technologies Memory Solutions Malaysia Sdn. Bhd., Penang, Malaysia, Introduction to Practical and Scientific Aspects of Hardware Reverse Engineering.
• Presentation: 2023-07-31, Infineon Technologies (Kulim) Sdn. Bhd., Kulim, Malaysia, Introduction to Practical and Scientific Aspects of Hardware Reverse Engineering.
• Guest lecture: 2023-01-26, Ruhr-Universität Bochum (RUB), Lecture: Introduction to Reverse Engineering, Title: Hardware Reverse Engineering at Infineon Technologies AG (Link).
• Talk: 2023-01-25, Bochum, Hardware Reverse Engineering Workshop (HARRIS 2023), Introduction to CRESS with Alex Hepp (Link).
• Talk: 2023-01-24, Bochum, Hardware Reverse Engineering Workshop (HARRIS 2023), Trust Your Hardware by Physical Inspection (Link).
• Talk: 2022-04-27, Technical University of Munich (TUM), PhD Seminar of the Chair of Security in Information Technology, Framework for Integrated Circuit Layout Verification via Hardware Reverse Engineering (Link).
• Talk: 2021-11-03, Technical University of Munich (TUM), PhD Seminar of the Chair of Security in Information Technology, CRESS: Framework for Vulnerability Assessment of Attack Scenarios in Hardware Reverse Engineering (Link).
• Webinar: 2021-03-26, virtual, 2nd AI4DI Webinar: AI for Semiconductor and Industrial Machinery Industries (Link).
• Poster Presentation: 2020-11-25/26, virtual, AI4DI at EFECS 2020: Poster presentation of our demonstrator.
• Presentation: 2020-01-23, University of Bologna, AI4DI Symposium, AI as Opportunity for VLSI IC Analysis (Link).
• Award: 2017-05-17, OTH Regensburg, VDI-Symposium "Potentiale der Digitalisierung": VDI Award for outstanding Bachelor's thesis (Link).

Education

Vita